Taiwan Semiconductor Manufacturing Co. (TSMC) has accelerated its deployment of advanced chip manufacturing technology in the United States, releasing for the first time interior footage of its Fab 21 plant in Phoenix, Arizona. The video showcases hundreds of advanced semiconductor manufacturing tools, including ASML's EUV lithography equipment, signaling a potential speed-up of its roadmap for producing 3-nanometer and more advanced chips at the facility. The move is widely seen as a strategic response to aggressive investments and announcements from competitors Intel and Samsung Electronics, particularly concerning next-generation 2-nanometer processes. By highlighting the progress and advanced equipment at its U.S. plant, TSMC is also aligning with the "Made in USA" policy, demonstrating its commitment to bolstering the American semiconductor ecosystem. There is no specific market reaction analysis available at this time.