Taiwan Semiconductor Manufacturing Co. is sending batches of engineers from its Arizona plant to Taiwan for specialized training on its advanced 3nm and 2nm production processes. This initiative is designed to equip the US-based team with the necessary expertise for the upcoming pilot manufacturing of these cutting-edge chips, which is slated to begin in Arizona in 2028. The move underscores TSMC's commitment to transferring its most advanced technology and knowledge to its new US facility. This training program is a critical step in operationalizing TSMC's multi-billion dollar investment in Arizona, aiming to bring the world's most sophisticated chip manufacturing to the United States. The success of this knowledge transfer is vital for the long-term production timeline and efficiency of the Arizona fab, which has faced previous reports of challenges related to workforce skillsets. The program is part of a broader strategy that also reportedly includes accelerating the establishment of an advanced packaging facility in Arizona.