Taiwan Semiconductor Manufacturing Co. has received approximately NT$147 billion (US$4.71 billion) in subsidies from the governments of the U.S., Japan, Germany, and China over the last two years to support its global expansion efforts. The financial data, compiled by the chipmaker, shows these funds are primarily directed towards the purchase of property, facilities, and equipment for its overseas subsidiaries, including those in Arizona, USA, and Kumamoto, Japan. The subsidies are part of agreements tied to specific construction and investment timelines for TSMC's new fabrication plants in these regions. This government support is crucial for TSMC's strategy to diversify its manufacturing footprint and meet the growing global demand for advanced semiconductors. The company's financial disclosures detail the ongoing financial aid received, with about NT$71.90 billion being provided in the first three quarters of 2025.