TSMC held an opening ceremony for its AP7 advanced packaging facility in Chiayi, Taiwan on December 4, 2025, with Phase 2 equipment installation underway and production expected to begin in 2026. The facility will host cutting-edge packaging technologies including WMCM, SoIC, and CoPoS across eight planned phases, supporting future chip production beyond 2nm nodes. TSMC's stock declined 0.56% to $293.81 in pre-market trading on December 4, following a strong close of $295.45 (+1.15%) on December 3. The modest decline reflects broader pre-market weakness as investors await Fed rate decisions and economic data, rather than company-specific concerns.