TSMC is reportedly speeding up its mass production schedule for CoPoS (Chip on Plain old Substrate) advanced packaging to 2029, with initial orders already being awarded to Taiwanese suppliers. This move comes as the market focuses on the surging demand for AI GPUs from companies like Nvidia and other custom ASICs, fueling optimism around TSMC's capacity expansion for its existing CoWoS packaging technology. The acceleration of the CoPoS timeline suggests TSMC is proactively working to meet future demands for more powerful and efficient chip integration. While the market's current focus is on the expansion of CoWoS capacity, this development points to the company's next-generation packaging strategy to maintain its technological lead in the semiconductor industry. There was no significant market reaction immediately available.