Amkor Technology and Taiwan Semiconductor Manufacturing Company (TSMC) today announced a 10-year agreement to enhance advanced semiconductor packaging capabilities in Arizona, critically supporting AI and high-performance computing applications. This partnership reinforces Amkor's pivotal role in the AI-related advanced chip packaging supply chain, building on a record Q1 2026 revenue driven by strong demand in AI data center applications. The company also has heavy 2026 capital expenditure plans ranging from $2.5 billion to $3 billion to expand its HDFO and other AI/HPC-focused capacity, notably at its Arizona facility.