ASML and Intel confirmed the successful installation and acceptance testing of the world's first commercial high-volume High-NA Extreme Ultraviolet (EUV) lithography system. Designated the Twinscan EXE:5200B, this event marks the beginning of the 'Angstrom Era' for semiconductor production.
The new tool enables the fabrication of smaller and more powerful transistors. Intel will use the machine to develop its next-generation 14A process node. The High-NA EUV machine provides higher resolution than previous EUV systems, a crucial step for keeping pace with Moore's Law.
This milestone solidifies ASML's technological leadership in the semiconductor equipment industry. The system is critical for Intel's future process technology roadmap.