ASML, TSMC, and imec successfully demonstrated n-type and p-type 2D-material transistors on 300mm wafers. This industry-compatible process transitions 2D semiconductor materials from research laboratories to high-volume manufacturing.
The partners unveiled the breakthrough at the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits. The demonstration showcased scaled devices at a 50nm contacted poly pitch (CPP).
This achievement enables the production of smaller, more powerful, and energy-efficient future chip generations. ASML remains a primary driver in the evolution of semiconductor manufacturing technology.