ASML Holding NV is expanding its product portfolio to include equipment for advanced artificial intelligence chip packaging. The Dutch company aims to develop tools that connect multiple specialized processors to facilitate the construction of powerful AI systems.
This expansion forms part of a strategic roadmap looking 10 to 15 years into the future of the semiconductor industry. ASML currently operates as the sole producer of critical extreme ultraviolet (EUV) lithography machines.
Chief Technology Officer Marco Pieters confirmed the company is researching its potential role in the packaging segment. ASML intends to leverage its existing expertise in optics and silicon wafer handling to develop these new technologies.