ASML has commenced high-volume shipments of its next-generation High Numerical Aperture (High-NA) EUV lithography systems. Key customers including Intel and Samsung have begun receiving the units. Each machine costs approximately $350 million and is the size of a double-decker bus.
The deployment signifies the start of the Angstrom Era in the semiconductor industry. These systems enable the production of chips featuring sub-2nm transistors. This technology allows chipmakers to move beyond the limitations of previous EUV systems.
High-NA tools replace complex multi-patterning techniques with more efficient single-exposure patterning for critical layers. This transition is expected to improve production yields and processor performance for AI and high-performance computing.
ASML stock experienced a decline on the day of the announcement. Market reports attributed the drop to broader tech sector pressures rather than the specific shipment news.