Intel completed the installation and testing of ASML's first commercial-grade High-NA EUV lithography system. The system, the Twinscan EXE:5200B, is now operational at Intel's D1X research facility in Oregon. The equipment cost $350 million.
This technology forms the cornerstone of Intel’s strategy to reclaim leadership in chip manufacturing. The system enables the company's planned 1.4nm process node.
This milestone places Intel ahead of competitors, including TSMC and Samsung, in adopting the next-generation technology. TSMC is not expected to move to High-NA for volume production until 2028 or later.
The event marks the official start of the High-NA era for the semiconductor industry. It cements ASML's crucial role in advancing chip technology.