Broadcom has commenced shipping the industry's first 2nm custom compute System-on-a-Chip (SoC) for artificial intelligence applications. The chip utilizes the company's 3.5D eXtreme Dimension System in Package (XDSiP) platform.
The platform employs Face-to-Face (F2F) technology to enable large-scale integration of processing units. This architecture delivers enhanced performance, superior power efficiency, and low latency.
This advancement addresses the massive computational demands of gigawatt-scale AI clusters. The technology provides the foundation for the next generation of advanced processors (XPUs).