Broadcom Inc. commenced shipping two advanced chips to strengthen its position in the AI and wireless infrastructure markets. The company launched the industry’s first 2nm custom compute System-on-a-Chip (SoC) built on its 3.5D platform for AI cluster hardware.
Broadcom also introduced the BroadPeak SoC to support next-generation 5G and 6G network infrastructure. These releases position the company as a primary custom silicon provider for hyperscale data centers.
The new hardware offers an alternative to Nvidia’s dominant AI offerings. Broadcom established a sales target of at least one million 3D-stacked AI chips by 2027.
These developments aim to drive long-term revenue growth and competitive positioning in high-growth technology sectors.