Broadcom expanded its artificial intelligence infrastructure portfolio to support the development of gigawatt-scale AI clusters. The new product suite includes a 3.5D extended-poly-urethane (XPU) processor.
The company introduced a 102.4T Ethernet switch featuring co-packaged optics. It also debuted the industry's first 400G/lane optical Digital Signal Processor (DSP).
These solutions aim to improve bandwidth and power efficiency for large-scale AI deployments. Broadcom will demonstrate these technologies at the Optical Fiber Communications Conference (OFC) in Los Angeles from March 15-19.
The launch follows significant AI-driven revenue growth reported in the company's recent fiscal first-quarter results. This expansion solidifies Broadcom's strategic focus on the artificial intelligence market.