Samsung Electronics and Broadcom signed a strategic memorandum of understanding valued at over $200 billion. This partnership extends through 2030 to build next-generation AI infrastructure.
Samsung will supply Broadcom with next-generation HBM4 and HBM4E memory for AI accelerators. Samsung’s foundry division will manufacture Broadcom’s AI and wireless communication chips. These components will utilize 2-nanometer and below process technologies and advanced packaging solutions.