Baidu's AI chip unit, Kunlunxin, is reportedly on track for a listing in Hong Kong. Kunlunxin joins a growing number of Chinese AI chip designers pursuing initial public offerings. This trend reflects Beijing's prioritization of technological self-sufficiency. Investor interest in the AI sector remains high.
The move is part of a broader wave of capital raising by Chinese chip companies. Montage Technology and Axera Semiconductor plan to raise a combined US$1.28 billion in Hong Kong IPOs. They will use the funds to support expansion and research and development efforts. Kunlunxin's planned listing follows the initial announcement of a proposed spin-off on January 1, 2026. The spin-off aims to showcase the unit's value and broaden its financing channels.