SK hynix unveiled a KRW 1,100 trillion ($720 billion) long-term investment strategy for South Korean AI-memory production. This phased plan extends beyond 2033 to meet surging demand for advanced chips like HBM4. The company allocated KRW 600 trillion of the total budget specifically for its Yongin site.
SK hynix also introduced a new open High Bandwidth Flash (HBF) standard in collaboration with SanDisk. This partnership aims to strengthen the company's position within the global AI infrastructure ecosystem.
Separately, the company reported a non-cash derivatives-related loss of approximately KRW 3.98 trillion for the first half of 2026. The loss stems from exchangeable bonds issued in 2023. Management emphasized that the accounting loss involves no cash outflow and has a minimal impact on total equity.