IBM and Lam Research signed a five-year strategic collaboration to develop manufacturing processes for sub-1-nanometer semiconductor chips. The partnership focuses on creating advanced fabrication techniques and new materials for future logic nodes.
The companies will leverage High-NA extreme ultraviolet (EUV) lithography to advance IBM’s logic scaling roadmap. This initiative prioritizes advanced etch and deposition capabilities to enable complex chip architectures.
This agreement extends a decade-long partnership between the two firms. Their previous cooperation yielded 7nm and nanosheet technologies, including the world’s first 2nm node chip.