Intel and 3D Glass Solutions (3DGS) signed an agreement to build a $3.3 billion substrate-manufacturing facility in Odisha, India. The plant will produce advanced glass-core substrates for next-generation semiconductors. This project operates under the India Semiconductor Mission with fiscal support from the Indian central government and the state of Odisha.
Construction in the Bhubaneswar-Khurda region will span five to six years. The facility focuses on advanced packaging to expand global semiconductor manufacturing capabilities.
Reports indicate a MediaTek client, likely Google, recently selected Intel’s advanced packaging technology over TSMC. This shift signals growing industry confidence in Intel’s foundry services.