MACOM Technology Solutions Inc. launched a new front-end chipset for 3.2T applications. The platform supports emerging optical architectures for AI infrastructure and high-speed networking.
The system combines new transimpedance amplifiers (TIAs) and photodiodes with existing 448 Gbps PAM-4 drivers. This single-vendor solution aims to reduce development time and optimize link performance. The integrated chipset targets the demanding requirements of next-generation optical interconnects.