Micron Technology and Applied Materials have partnered to accelerate the development of next-generation memory and storage solutions for artificial intelligence. The collaboration focuses on advanced DRAM, high-bandwidth memory (HBM), and NAND technologies. These solutions aim to improve the energy-efficient performance of future AI systems.
Joint research and development will leverage Applied Materials' EPIC Center in Silicon Valley and Micron’s innovation hub in Boise, Idaho. The partnership combines expertise in materials engineering and manufacturing innovation to strengthen the semiconductor pipeline within the United States.