Micron Technology announced plans to expand its global manufacturing footprint. The expansion addresses surging demand for AI-related memory chips.
Micron signed a $1.8 billion letter of intent to acquire a 300mm fabrication plant in Taiwan. This move aims to increase DRAM capacity.
Wafer output is expected to begin in the second half of 2027.
Micron also commenced construction on a new advanced wafer fabrication facility in Singapore. This project involves an investment of approximately $24 billion.
Both initiatives strategically aim to alleviate tight supply conditions for high-bandwidth memory (HBM) and NAND products.
HBM and NAND are crucial components for artificial intelligence and data center applications. These expansions underscore Micron's focus on capitalizing on the robust, long-term growth trajectory of the AI sector.