onsemi introduced its Embedded Power Platform (EPP) on September 16, 2026. This architecture uses the silicon wafer as the package foundation to integrate silicon, silicon carbide, and GaN into a single device.
The platform delivers three to five times higher power density than current solutions. This technology targets power constraints in artificial intelligence data centers, electric vehicles, and industrial automation.
Subaru will evaluate the platform for future electric vehicle designs as an early partner. onsemi expects to begin sampling the technology with strategic customers in 2026.