Samsung Electronics plans to double production of HBM4 and HBM4E memory in 2025 to meet surging AI demand. The company will increase outsourced glass carrier cleaning from 20,000 to 50,000 wafers per month.
Mass production of HBM4 began in February 2024. Samsung delivered 12-layer HBM4E samples to major clients including NVIDIA in May.
Monthly HBM wafer inputs are projected to rise from 180,000 to 250,000 next year. Advanced HBM4 series shipments are expected to grow from 40% to 80% of total output.