Samsung Electronics signed a $200 billion memorandum of understanding with Broadcom. The strategic partnership spans the next five years. The collaboration focuses on supplying advanced memory chips and wafer foundry services.
Samsung will utilize 2-nanometer and below process technology for the project. The agreement supports Broadcom’s development of next-generation AI accelerators for the artificial intelligence infrastructure market.
This deal enhances Samsung’s role in the global AI supply chain and strengthens its foundry division. The partnership aligns with South Korea’s $950 billion initiative to bolster its domestic semiconductor industry.