TSMC develops quasi-EMIB technology, challenging Intel in AI chip packaging

TSMC is developing an advanced chip-packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB). Internal sources refer to the project as quasi-EMIB. The company has already discussed the technology with several customers.

This initiative responds to Intel's expanding influence in advanced packaging, a major bottleneck for AI chip production. Intel's EMIB uses silicon bridges for high-speed chip connections.

Major AI players view Intel's technology as a viable alternative to TSMC's CoWoS packaging. While TSMC currently dominates the market, its CoWoS capacity remains constrained.