Taiwan Semiconductor Manufacturing Company (TSMC) is accelerating the development of its 2nm manufacturing process. The company targets a production capacity of 100,000 wafers per month. It expects to reach this milestone by the end of 2026.
Surging demand from Nvidia, AMD, and Broadcom for high-efficiency data center chips drives the expansion. TSMC is also pulling forward production targets for its current 3nm process to meet sustained market interest.
This acceleration secures manufacturing capacity for future hardware from Apple, Qualcomm, and MediaTek. The move solidifies TSMC’s technological lead as the AI sector competes for cutting-edge production nodes.