MediaTek now supports advanced packaging technologies from both TSMC and Intel. The Taiwanese chip designer adopted this dual-sourcing strategy to secure supply for its expanding custom artificial intelligence (AI) business.
The move addresses capacity constraints for TSMC’s industry-leading CoWoS packaging. Surging demand for AI accelerators has overwhelmed current TSMC production lines.
MediaTek will incorporate Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) technology. This provides customers with a crucial alternative to mitigate risks associated with relying solely on TSMC.
The decision validates Intel’s efforts to compete as a major foundry and packaging provider. This supply chain flexibility is central to MediaTek’s goal of expanding its data center market presence.