Taiwan Semiconductor Manufacturing Co. (TSMC) will construct three additional advanced packaging facilities in the Chiayi Science Park. The announcement occurred during the groundbreaking ceremony for the park’s second phase.
The new facilities will generate over NT$300 billion in annual output. This production value equals approximately US$9.35 billion.
TSMC currently faces a 20% supply-demand gap for its CoWoS (Chip-on-Wafer-on-Substrate) technology. The AI boom continues to drive overwhelming demand for these advanced packaging solutions.
This production targets the surging global demand for high-performance computing (HPC) chips. The expansion aims to alleviate supply chain bottlenecks for AI accelerators and secure TSMC's market leadership as competitors receive spillover orders.