SK hynix unveiled its technology roadmap at the annual Future Forum, focusing on next-generation memory for the AI era. The strategy prioritizes 3D-stacked chips and memory solutions tailored to specific AI workloads.
CEO Kwak Noh-jung stated the memory market has shifted from a speed race to a landscape requiring flexible adaptation. The company aims to solidify its leadership through advanced 3D-stacked DRAM and customized storage technologies. These innovations address the increasing demand for efficient processing of massive data sets.