Intel is negotiating with Google and Amazon to provide advanced chip packaging services. This technology combines multiple "chiplets" into single processors, a process essential for modern AI hardware. The company is leveraging its EMIB and Foveros technologies to drive growth for its foundry division.
These discussions support Intel’s strategy to challenge TSMC as a leading contract chip manufacturer. Landing contracts with major tech firms would mark a significant strategic milestone for Intel's foundry business. Intel’s CFO previously indicated the packaging segment is nearing deals worth billions of dollars in annual revenue.