Intel Foundry positions its Rio Rancho, New Mexico facility as its global hub for next-generation glass substrate production and advanced packaging.
The company deploys EMIB and Foveros technologies to resolve industry-wide supply constraints.
Glass substrates offer benefits over traditional solutions.
These traditional solutions face shortages due to the AI supercycle.
Analysts view advanced packaging as a key driver for Intel's turnaround.
Analysts project potential gross margins of 40% for the company.
Tech giants Amazon and Google explore packaging partnerships with Intel.