Microsoft CEO Satya Nadella and SK Group Chairman Chey Tae-won met to expand their artificial intelligence partnership. The collaboration moves beyond semiconductors to include AI data centers and solutions.
The end-to-end alliance covers AI chips, data center construction, and cloud-based services. SK Hynix aims to establish a long-term agreement to supply Microsoft with High Bandwidth Memory (HBM).
These HBM supplies support Microsoft's AI accelerators. The move strengthens Microsoft's AI infrastructure and service capabilities.