SK hynix will hold a groundbreaking ceremony for its new advanced chip packaging facility on August 27. The $3.87 billion plant is located in West Lafayette, Indiana. Mass production of high-bandwidth memory (HBM) for AI processors will begin in the second half of 2028. The U.S. government is providing up to $450 million in direct funding via the CHIPS Act.
KB Securities projects combined operating profits for SK hynix and Samsung Electronics will approach 1,000 trillion won by 2027. Analysts consider current stock prices for both semiconductor giants to be undervalued. The report anticipates significant growth as the global semiconductor market rebounds.