Samsung Electronics signed a memorandum of understanding with U.S. chip designer Broadcom valued at over $200 billion. This expanded strategic partnership extends through 2030.
The collaboration covers memory chips, contract manufacturing, and advanced packaging to support global AI infrastructure. Broadcom will utilize Samsung’s sub-2-nanometer process technology for its next-generation products.
The agreement combines Broadcom’s custom chip designs with Samsung’s advanced manufacturing capabilities. This long-term commitment aims to strengthen Samsung’s position in the competitive AI semiconductor market.