TSMC will construct three additional advanced packaging facilities in southern Taiwan’s Chiayi Science Park.
The company announced the expansion during a groundbreaking ceremony for the park's second phase. This development phase focuses on establishing an advanced packaging industry cluster led by TSMC.
Surging global demand for high-performance computing and AI chips drives the expansion. These processors rely on TSMC’s proprietary CoWoS advanced packaging technology.
The three new plants will join two existing facilities from the first phase that have already entered mass production.
Full operations across both phases are projected to generate over NT$300 billion (US$9.35 billion) in annual output. The project is expected to create thousands of local jobs.