Taiwan Semiconductor Manufacturing Co. (TSMC) will build two additional advanced chip packaging plants in Southern Taiwan’s Chiayi Science Park. A Taiwanese minister announced the expansion during a groundbreaking ceremony for the park’s second phase. TSMC will lead the development to establish an advanced packaging industry cluster.
The new facilities bring the total to four TSMC plants in the park. This expansion addresses global demand for high-performance computing and AI chips. The project specifically targets capacity for Chip-on-Wafer-on-Substrate (CoWoS) technology.
The complex expects to generate over NT$300 billion in annual output. This total equals approximately US$9.35 billion. The development will create more than 9,000 jobs.