Taiwan Semiconductor Manufacturing (TSM) announced a massive \$52-56 billion capital expenditure budget for 2026 aimed at doubling its CoWoS advanced packaging capacity to 130,000-150,000 wafers per month, specifically targeting NVIDIA's Rubin AI accelerators.
- The expansion is primarily driven by surging demand, with NVIDIA securing over 60% of the new capacity.
- The strategic investment aims to resolve current AI hardware bottlenecks and emphasizes a shift toward high-margin chiplets and advanced packaging.
- TSM is currently trading at \$332.88, down 0.59% amid the news.