Taiwan Semiconductor Manufacturing Co. (TSMC) has suspended accepting new customer projects for its 3nm process. This decision stems from fully booked capacity. TSMC now encourages clients to transition to its next-generation 2nm node.
The 2nm process features a more favorable cost structure and introduces a new nanosheet transistor architecture. This architecture offers significant gains in performance and power efficiency. TSMC views the shift as a strategic effort to optimize costs and accelerate adoption of its latest technology.
Demand for the 2nm node appears strong. Reports indicate the process has received 1.5 times the number of new chip designs ('tape-outs') compared to the 3nm process at a similar stage. This transition coincides with TSMC officially commencing mass production of its 2nm chips.