TSMC and Amkor Technology signed a 10-year agreement to expand advanced semiconductor packaging in the United States. TSMC will procure advanced packaging and testing services from Amkor under this new framework. The deal aims to establish a resilient and integrated domestic supply chain.
Both companies are currently investing in Arizona infrastructure. TSMC is developing leading-edge fabrication facilities while Amkor builds a new advanced packaging and test campus.
The partnership targets faster time-to-market for high-performance computing and artificial intelligence customers. This collaboration creates a complete U.S. supply chain from silicon manufacturing to final device packaging.