Intel and SK Hynix announced a collaboration to develop advanced semiconductor packaging for the artificial intelligence sector. SK Hynix will utilize Intel’s Embedded Multi-die Interconnect Bridge (EMIB) 2.5D packaging technology. This partnership integrates High Bandwidth Memory (HBM) with logic chips more efficiently.
The alliance provides a competitive alternative to TSMC’s CoWoS packaging, the current industry standard for AI accelerators. SK Hynix aims to diversify its supply chain beyond TSMC through this agreement. The deal provides Intel’s foundry services with a significant endorsement from a leading memory supplier.
Shares for both Intel and SK Hynix surged following the announcement. Market analysts view advanced packaging as a critical component for next-generation AI systems.