Samsung Electronics and Broadcom signed a strategic memorandum of understanding at an AI Summit in San Francisco on Saturday. The partnership spans memory, contract chipmaking, and advanced packaging.
The collaboration is projected to exceed $200 billion in value by 2030. This agreement aims to secure a stable supply chain for critical AI components.
Samsung’s foundry business gains long-term production commitments from Broadcom through this deal. The move strengthens Samsung’s competitive position against market leader TSMC.
The partnership combines Broadcom’s application-specific integrated circuit (ASIC) expertise with Samsung’s sub-2-nanometer manufacturing technology. It also incorporates next-generation High-Bandwidth Memory (HBM) products.