Intel and SK Hynix are collaborating to utilize Intel’s Embedded Multi-die Interconnect Bridge (EMIB) technology for 2.5D packaging. This partnership enhances connectivity between multiple semiconductor dies to improve performance for data center and AI chips. Intel shares rose more than 5% in premarket trading following the report.
The alliance addresses the rising demand for sophisticated packaging solutions fueled by artificial intelligence expansion. Combining chiplets with high-performance interconnects allows for the creation of more powerful, customized processors.
This move strengthens Intel’s competitive position in the foundry and advanced packaging markets against rivals like TSMC. The collaboration reflects a broader industry shift toward heterogeneous integration to meet next-generation computing demands.