Intel and SK Hynix launched a research partnership for advanced 2.5D chip packaging on May 11, 2026. The collaboration integrates SK Hynix’s High-Bandwidth Memory with logic chips using Intel’s Embedded Multi-die Interconnect Bridge technology.
SK Hynix seeks to diversify its supply chain beyond its heavy reliance on TSMC. TSMC currently faces capacity constraints driven by high demand for AI chips.
The partnership builds on Intel’s recent preliminary agreement to manufacture chips for Apple. This move strengthens Intel’s foundry services as it competes for major clients seeking alternatives to TSMC.
Intel shares rose 2% to 5% during the day following the news. Investors view the deal as a significant validation of Intel’s corporate turnaround strategy.