Taiwan Semiconductor Manufacturing Company (TSMC) raised its 2030 global chip market forecast to $1.5 trillion. This projection represents a 50% increase over the previous $1 trillion estimate. TSMC released these figures in materials for its technology symposium on Thursday.
AI and high-performance computing will likely account for 55% of the total semiconductor market by 2030. TSMC expects its advanced CoWoS packaging capacity to grow at an 80% compound annual rate between 2022 and 2027. This specialized packaging is essential for AI processors produced by companies like Nvidia. The manufacturer is currently expanding its global production capacity to meet this demand.