Taiwan Semiconductor Manufacturing Co (TSMC) is seeking government approval for a new advanced wafer fab in Hsinchu Science Park’s Longtan campus. The park’s bureau will submit the proposal to the National Science and Technology Council for review later this month.
The proposed facility will develop angstrom-class processes equivalent to 0.1nm. This technology aims to satisfy surging demand for artificial intelligence computing.
Project investments are estimated between NT$500 billion and NT$600 billion. The US dollar equivalent for this investment ranges from $15.8 billion to $19 billion. This initiative revives a previous expansion plan shelved in 2023 due to local opposition.