TSMC plans to aggressively expand its advanced process production capacity starting in 2026. The company will increase monthly 2nm wafer output from 90,000 to 110,000 units. It aims to raise 3nm capacity from 180,000 to 210,000 wafers per month by mid-2027. This represents a 70% increase for the 3nm process over an 18-month period.
Surging global demand for artificial intelligence semiconductors drives this expansion. TSMC increased its 2026 capital expenditure guidance to between $60 billion and $64 billion. The company has secured order visibility through 2029-2030.
TSMC shares fell 1.24% on September 14 despite the positive long-term outlook. A broader sell-off in technology and chip stocks pressured valuations across the sector. Industry leaders’ calls to slow AI development reportedly influenced the market decline.