TSMC and ASML are upgrading extreme ultraviolet (EUV) photomasks from 6-inch to 12-inch formats. The collaboration targets a pilot line for the new format by 2031. TSMC plans to deploy High NA EUV technology for high-volume manufacturing in 2030.
TSMC shares rose NT$15 on September 9, 2026. The stock reached a new swing high of NT$2,485. This upgrade intends to boost manufacturing productivity and lower costs for future semiconductor generations. TSMC, Intel, and Samsung have committed to advancing this next-generation technology.