A hardware leaker provided details on AMD's next-generation Zen 6 processor architecture. The leak suggests the new Zen 6 Core Complex Die (CCD) will utilize TSMC's advanced 2nm process node.
The 2nm process is expected to increase density significantly. The leak claims a 50% increase in core count, moving to 12 cores per CCD from 8.
Cache memory is also projected to increase by 50%. The overall die size will be only slightly larger than current Zen 5 chips. This suggests a substantial future uplift in performance and efficiency for AMD. AMD has not confirmed this information.