Intel and Intel Foundry researchers announced a breakthrough in next-generation capacitor materials for chip power delivery.
The new materials reach an intrinsic capacitance density of 98 fF/μm². This exceeds the 37 fF/μm² found in current state-of-the-art technology.
The advancement enables stable power delivery for higher performance and energy efficiency. Applications include data center AI workloads and mobile device battery life.
Superior material properties drive these gains rather than structural complexity. This approach facilitates integration into future manufacturing processes.